EC468 Signal Integrity and EMI/ EMC

Course Name: 

EC468 Signal Integrity and EMI/ EMC


B.Tech (ECE)


Programme Specific Electives (PSE)

Credits (L-T-P): 

(3-1-0) 4


Fundamentals, Basics of EMI/EMC: coupling mechanisms, why to consider EMC, typical sources and victims, time domain vs. frequency domain, near vs. far field, non-ideal components, controlling signal return currents, differential vs. common mode currents, radiation and pickup from loop and dipoles, the “hidden schematic” idea, etc. High Speed/Frequency Effects In Electronic Circuits, Components In RF/EMI/ EMC /Si, Transmission Lines: Controlling Propagation, Matching, Signal Integrity Parameters, undesired effects, propagation time and delay, reflections and ringing, crosstalk (near and far) and jitter. Delays. Jitter. Signal ground versus safety ground, grounding strategies, ground loops, techniques to minimize ground impedance Grounding, Filtering, Printed Circuit Boards (PCBs), Shielding, Cables, Transients, Diagnostics and Troubleshooting Techniques.


Huray P.G.: The Foundations of Signal Integrity. J. Wiley & Sons, Hoboken, 2010
Hall S.H., Heck H.L.: Advanced Signal Integrity for High-Speed Digital Designs. Wiley-IEEE Press, 2009.
Bogatin E.: Signal Integrity – Simplified. Prentice Hall, 2004.
Johnson H. W.: High Speed Signal Propagation: Advanced Black Magic. Prentice Hall, 2003.
Caniggia S., Maradei F.: Signal Integrity and Radiated Emission of High-Speed Digital Systems. John Wiley & Sons, 2009.


Electronics and Communication Engineering(ECE)

Contact us

Prof. N. Shekar V. Shet, Professor and Head, 
Department of ECE, NITK, Surathkal
P. O. Srinivasnagar,
Mangalore - 575 025 Karnataka, India.

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